• 3 M 9077 9078 9079 Ultra High Temperature Double Coated Non-Woven Adhesive Tape for Printed Circuit Boards
  • 3 M 9077 9078 9079 Ultra High Temperature Double Coated Non-Woven Adhesive Tape for Printed Circuit Boards
  • 3 M 9077 9078 9079 Ultra High Temperature Double Coated Non-Woven Adhesive Tape for Printed Circuit Boards

3 M 9077 9078 9079 Ultra High Temperature Double Coated Non-Woven Adhesive Tape for Printed Circuit Boards

Color: Transparent
Material: Non-Woven Cloth
Waterproof: Waterproof
Thickness: 0.05mm
Transport Package: Cartons Packing
Specification: 500mm * 100m
Samples:
US$ 390/Piece 1 Piece(Min.Order)
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Customization:
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Manufacturer/Factory

Basic Info.

Model NO.
3M 9077
Trademark
3 M
Origin
China
HS Code
3919909090
Production Capacity
1000000rolls/Month

Product Description

Product Description

3 M 9077 Ultra High Temperature Double Coated Non-woven Adhesive Tape For Printed Circuit Boards

3 M Ultra High Temperature DoubleCoated Tape 9077 utilizes a high performance and low outgassing adhesive system having excellent
heat resistance in high temperature environments. This adhesive system has excellent holdingpower and much higher adhesion strength at high temperaturesthantypicalpressuresensitiveadhesivetapes. 3M Ultra High Temperature Double Coated Tape 9077 is a double coated non-woven adhesive tape with improved die-cut and converting performance.


3 M 9077 9078 9079 Ultra High Temperature Double Coated Non-Woven Adhesive Tape for Printed Circuit Boards
 
Feature
 
• Hightemperaturerelease liner thatis abletosurvive fromatypical lead-free solder reflow process having a peak temperature up to 500°F (260°C).
• IdealforFlexiblePrintedCircuit (FPC)attachments inmanyareasof electronics subjected to high temperature processing and operating environments.
• Releasable after lead-free solder reflow.
• High adhesion, excellent holding power and low outgas.
Features
This tape has a film carrier which can add dimensional stability to foams and other substrates and also makes it easier to handle the tape during slitting and die-cutting. 
• The bond strength of 3 M Laminating Adhesive 300LSE increases as a function of time and temperature, and has very high initial adhesion.
Application
* Printed circuit boards
* Flexible circuits
* Automotive underhood
* Heat sink bonding
 
 
3 M 9077 9078 9079 Ultra High Temperature Double Coated Non-Woven Adhesive Tape for Printed Circuit Boards
 
 
Company Information
 
3 M 9077 9078 9079 Ultra High Temperature Double Coated Non-Woven Adhesive Tape for Printed Circuit Boards3 M 9077 9078 9079 Ultra High Temperature Double Coated Non-Woven Adhesive Tape for Printed Circuit Boards
3 M 9077 9078 9079 Ultra High Temperature Double Coated Non-Woven Adhesive Tape for Printed Circuit Boards

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